Device programming, marking and reeling specialists
Moisture control and re-packaging services to manufacturers' specifications.
Action Circuits can moisture bake and repackage electronic devices to protect them from damage during the soldering process, with industry standard bake times ranging from 6 hours to 24 hours at 125°C, or reduced temperatures for longer periods.
During surface mount soldering, moisture retained in a device's packaging can cause cracking and delamination, so sensitive devices are shipped and stored in hermetically sealed moisture barrier bags to maintain dry conditions until use.
Our procedures are based on the EIA JEDEC standard JESD22-A112 and International Standard STD020, which define six levels of moisture sensitivity, and all process areas are air-conditioned and humidity controlled.
Manufacturer dry bag conditions are recorded.
Devices are opened, processed and pass final inspection.
Devices are re-sealed in vacuum packed hermetically sealed moisture barrier bags with indicator card and the correct units of desiccant.
The total exposure time, together with exposure level, is recorded on the bag.
If devices have been over exposed, Action Circuits can offer device baking and re-packaging services to the manufacturers' specifications.
Contact Action Circuits now and receive a turnaround and quality of service that exceeds your expectations.
